Enterprise Europe Network

A Japanese company is looking for EU distributors and agents for its temporary bonding material (film, tape) used in the semiconductor industry

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External Id: 
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Partner keyword: 
Semiconductor materials (e.g. silicon wafers)
Manufacture of other chemical products n.e.c.


The Japanese chemical components manufacturer is aiming to expand their presence in the EU. Offering multiple processes use UV tapes specific for the semiconductor industry, their product states improved performances compared to conventional tapes. Higher heat resistance with lower residue for example. A distribution or commercial agreement will be achieved with EU agent or distributors who have good connections within the European semiconductor industry.



The Japanese company provides chemical products for semiconductor manufacturing processes and its temporary bonding material for manufacturing processes has been widely used in Asian markets. One of the remarkable use cases of the product is for complicated processes for smartphone processors, which requires one of the most advanced technologies currently in that sector.

The company’s temporary bonding material is positioned between wax (adhesive) and conventional tapes and can be used for various processes such as back grinding, reflow, chemical / thermal curing and it features the following three strengths: easy peeling, heat resistance and high reliability.

Applications for the product are as follows:
- Wafer Warpage Control
- Fan Out Wafer Level Package
- Package on package
- Metal plating
- Protecting bump from sputtering for Electro-Magnetic Interference (EMI) shielding

The Japanese company would like to expand into the EU and they are looking for experienced distributors or agents related to semiconductor industries and partners who have connections with engineers for semiconductor processes.
A distribution or commercial agreement will be achieved with relevant partners.

Advantages & innovations

Cooperation plus value: 
Most conventional tapes or adhesives used in the semiconductor manufacturing are made for a given process and not adapted to multiple processes use. Performances of conventional UV tapes come together with other incompatibilities, for example they are usually strong for heat but prone to high residue. Differently from conventional items, the company product can be used for various processes, eliminating the need to laminate, delaminate and cleaning stages. Specifically about the residue aspect, the company’s product can be used for heat processes such as reflow with extremely low residue (no need for detergents) through N2 gas release debonding technology. Below are the main features of the company products: - Heat Resistance: up to 260˚ Celsius (Reflow) compared to appr.150˚ Celsius for conventional UV tape: - Anti-Electro-Static Discharge - ESD) (Plasma Etching, Physical Vapor Deposition Process) - Chemical Resistance (Metal Plating, Under Bump Metallization - UBM) - Low residue This technology can be a one stop solution for semiconductor processes and it makes the semiconductor manufacturing process easier, faster and cheaper.

Partner sought

Cooperation area: 
Ideal partners should understand all the packaging process of semiconductors and handle not only tapes or films but also equipment like a package master. Potential partners are experienced distributors or agents related to semiconductor industries, ideally having networks from sales perspective but also of engineer one. Targeted customers are chip manufacturers as well as makers of modules and sensors with own facilities/lines.

Type and size

Cooperation task: 
SME 11-50,SME <10,>500 MNE,251-500,SME 51-250,>500


Dissemination sector group : 
Dissemination preferred : 
Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, United Kingdom