Enterprise Europe Network

Polymeric nanocomposite-based heat sink for electronic devices

Country of origin:
Country: 
SINGAPORE
Opportunity:
External Id: 
TOSG20190108005
Published
23/01/2019
Last update
31/01/2020
Expiration date
12/08/2020

Keywords

Partner keyword: 
Plastics, Polymers
Other electronics related equipment
Polymer (plastics) materials
Manufacture of other electrical equipment
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Summary

Summary: 
A Singapore academic and research institute has developed a heat sink using a thermally conductive polymeric nanocomposite material. The heat sink has high thermal conductivity, mechanical strength, and electrical resistance. The institute is seeking partnerships with all sizes of SMEs and MNEs through technology licensing agreements.

Description

Description: 

The institute has developed the heat sink by employing widely used cost-effective thermally conductive polymeric nanocomposite material that can be easily injection-molded to various shapes and sizes.

The polymeric nanocomposite material can be considered as an effective alternative to metals used for the manufacture of conventional heat sinks; the resultant heat sink is lightweight in nature and resistant to corrosion. It also exhibits electrical insulation properties and high mechanical strength. The heat sink developed using the polymer is injection moldable and can be easily integrated with several parts of an electronic device or system.

Apart from its use as a heat sink for electronic devices, it has potential use in device casings, high-power battery casings, aircraft and automobile structure components as well as pipes, tubes, and containers in marine, off-shore, and oil and gas applications.

The heat sink, fabricated using the polymer exhibits thermal conductivity that is significantly higher than the currently available heat sinks in the market.

The institute seeks licensing agreements with MNEs and SMEs of all sizes.

Advantages & innovations

Cooperation plus value: 
The heat sink can be easily fabricated using standard processing and molding techniques and does not require specialized processes, thereby reducing production costs. The material used allows for design flexibility, ease of fabrication, and formulation; besides, it has a controlled percolation threshold. It also exhibits enhanced thermal stability, high electrical and thermal conductivity (around 10 times higher than currently used ones) and tunable properties that help in enhancing design flexibility and meeting specific end-product requirements. The developed polymeric nanocomposite and the heat sink are better alternatives to metal-based heat sinks for various component and product developers in the electronic and manufacturing industries.

Stage of development

Cooperation stage dev stage: 
Field tested/evaluated

Partner sought

Cooperation area: 
The Singapore institute seeks to partner SMEs of all sizes and MNEs in the form of a licensing agreement where the partner can license the technology and incorporate it into its applications. The partner can be product developers or manufacturers of electronic devices or components.

Type and size

Cooperation task: 
SME 11-50,SME <10,>500 MNE,251-500,SME 51-250,>500