The institute has developed the heat sink by employing widely used cost-effective thermally conductive polymeric nanocomposite material that can be easily injection-molded to various shapes and sizes.
The polymeric nanocomposite material can be considered as an effective alternative to metals used for the manufacture of conventional heat sinks; the resultant heat sink is lightweight in nature and resistant to corrosion. It also exhibits electrical insulation properties and high mechanical strength. The heat sink developed using the polymer is injection moldable and can be easily integrated with several parts of an electronic device or system.
Apart from its use as a heat sink for electronic devices, it has potential use in device casings, high-power battery casings, aircraft and automobile structure components as well as pipes, tubes, and containers in marine, off-shore, and oil and gas applications.
The heat sink, fabricated using the polymer exhibits thermal conductivity that is significantly higher than the currently available heat sinks in the market.
The institute seeks licensing agreements with MNEs and SMEs of all sizes.