Enterprise Europe Network

Seeking technology and experts in epoxy solder paste development

Country of origin:
Country: 
SINGAPORE
Opportunity:
External Id: 
TRSG20200814001
Published
17/08/2020
Last update
28/08/2020
Expiration date
29/08/2021

Keywords

Partner keyword: 
Printed circuits and integrated circuits
Adhesives
Metals and Alloys
Plastics, Polymers
Conductive materials
Other electronics related (including keyboards)
Coatings and adhesives manufactures
Speciality/performance materials: producers and fabricators
Other speciality materials
Electronic chemicals
Manufacture of other chemical products n.e.c.
EXPRESS YOUR INTEREST

Summary

Summary: 
A Singapore SME is seeking technology partners with the relevant technology and expertise to co-develop epoxy solder paste formulations as an alternative bonding material. The new bonding material can be applied to soldering components such as flexible circuits, display panels and in other electronics component manufacturing. The SME is keen to seek partnerships in licensing, research or commercial agreements with technical assistance with startups and SMEs of all sizes.

Description

Description: 

With the growing demand for flexible printed circuits and rigid-flex circuits, the electronic components market is seeing new generations of materials being used for soldering and bonding. New product requirements also require a shift in how soldering and bonding will be done.

Novel epoxy solder paste formulations present an alternative bonding solution that can be applied to soldering components such as flexible circuits and display panels.

The Singapore SME, a soldering manufacturer is keen to explore the following partnerships with startups and SMEs of all sizes:

i) Licensing agreements
The Singapore SME will license the partner's technology to develop and commercialise it.

ii) Research cooperation
Both companies will jointly undertake research and further develop the technology.

ii) Commercial agreements with technical assistance
The partner will provide technical support to the Singapore company with the establishment of a commercial agreement.

Technical Specification or Expertise Sought

Cooperation sought: 
The desired technical specifications of the epoxy solder paste are as follows: - The flux and epoxy chemistries must be able to withstand the reflow process of 250⁰C. - The epoxy residue will need to meet the minimum SIR (Surface Insulation Resistance) reading as set forth in the IPC J-STD 004 requirement. - The performance of the bonding strength of the epoxy encapsulation must be at least 10% more than the company's existing product. The relevant technology partner should be knowledgeable in flux and epoxy chemistries, with experience in chemical processing.

Stage of development

Cooperation stage dev stage: 
Prototype available for demonstration

Partner sought

Cooperation area: 
The Singapore SME seeks the following types of partnerships with SMEs of all sizes. i) Licensing agreement - The Singapore SME could license the technology and develop it further for commercialisation. ii) Commercial agreement with technical assistance - The partner will provide support in the transfer of the technology with the provision of additional support services. iii) Research cooperation agreement - The Singapore SME will provide support in the joint development of the technology.

Type and size

Cooperation task: 
SME 11-50,SME <10,SME 51-250