With the growing demand for flexible printed circuits and rigid-flex circuits, the electronic components market is seeing new generations of materials being used for soldering and bonding. New product requirements also require a shift in how soldering and bonding will be done.
Novel epoxy solder paste formulations present an alternative bonding solution that can be applied to soldering components such as flexible circuits and display panels.
The Singapore SME, a soldering manufacturer is keen to explore the following partnerships with startups and SMEs of all sizes:
i) Licensing agreements
The Singapore SME will license the partner's technology to develop and commercialise it.
ii) Research cooperation
Both companies will jointly undertake research and further develop the technology.
ii) Commercial agreements with technical assistance
The partner will provide technical support to the Singapore company with the establishment of a commercial agreement.