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A Lithuanian SME, specializing in hard material laser processing tools and technology development, is offering their developed Silicon Carbide and Gallium Nitride wafer scribing/dicing technology and optical engine for semiconductor device manufacturers. The company will consider possible commercial agreements with technical assistance, financial, license and manufacturing agreements with manufacturers as well as joint venture and research cooperation agreements with research institutions.
This is an advanced technology company that provides solutions for laser micromachining. The company currently specializes in scribing of hard semiconductor and dielectric materials by using ultrashort pulse lasers.
The tool offered by the company is a state of the art optical engine for Silicon Carbide and Gallium Nitride semiconductor wafer scribing and dicing designed to suit the needs of the semiconductor device industry that uses these materials. This technology allows fast single pass (300 mm/sec) up to 0,4 mm thick SiC or GaN wafer scribing and dicing with high-quality right angle cut profiles, allowing for easy breaking with no peeling or chipping of the semiconductor material. The optical engines are compact (~400 x 410 x 700 mm) and with a small footprint. Single, double or multiple beam focus as well as beam focus depth inside the wafer is adjustable. Beam power, pulse duration and repetition adjustments are possible. Additional functions can be added for engines under request from the partners.
Possible different types of partnerships - commercial agreements with technical assistance, financial, license or manufacturing agreements - are sought with companies that work in the semiconductor or electronic device industries and use SiC or GaN semiconductors, requiring advanced high-quality processing methods. Partners could also be companies with expertise in these fields that are interested in joint venture or research cooperation agreements for further development and commercialization of this technology.
This technology is meant for solving problems faced in current SiC and GaN dicing technologies:
- Processing speed of this technology is 300 mm/sec, compared to 10 - 20 mm/sec of current competitor technologies;
- This technology requires less energy and material consumption to achieve same results as competitors using currently available technologies;
- This technology provides high-quality right angle cuts allowing for easy breaking of the wafers without chipping or peeling of the material.
This technology solves problems like slow processing velocity, wide street necessity, large debris and chipping of the process, material overheating issues and high running costs that are problems currently faced by using other technologies.
This technology allows processing throughput that is 5 times higher than that of current competitor technologies with expenses that are 5 times lower.
Optical engine is ready for commercialization.
Patents applied in EU, US, China, Japan, S. Korea, Japan, Russia. Already granted in Taiwan.
The partners that could take advantage of commercial agreements with technical assistance, financial, license and manufacturing agreements should be SiC and GaN employing semiconductor device manufacturers and integrators that require innovative solutions for scribing and dicing of these semiconductor materials.
The partners that would be interested in joint venture and research cooperation agreements should be private companies in the field of semiconductor industry and electronics.
The CEO of the company is a co-author of 8 patents granted to previous employer in Japan.