If you would like more information about the profile please click
. You will be directed to a new page where you will need
to provide some information about yourself/your business cooperation needs and submit
your expression of interest in the profile . A Network Partner will then contact
you to discuss your interest in greater detail.
A Singapore research institute has developed a thermal management system with a heat sink that provides a mechanism to relieve the pressure that arises in the chamber during the expansion of the phase change material (PCM). With this system, constant contact interface between the PCM and heat sink walls can be maintained to improve thermal conductivity.
The institute seeks to partner SMEs/MNEs such as electronics/electrical device/component manufacturers through licensing agreements.
Thermal management systems generally constitute a heat sink manufactured using PCM. The containment has a direct correlation to the thermal conductivity of the thermal management systems. One of the ways to improve thermal conductivity is to ensure that there is a large contact surface area between PCM and the capsule continuously, while accommodating for the potential expansion of PCM.
However, the most common method used to encapsulate the PCM in the heat sinks is by filling and sealing of the chamber when the PCM is in its expanded (liquid) state. This leads to negative pressure in the chamber when PCM cools and contracts.
An alternative method involves the use of void air spaces in the chamber to facilitate the expansion of PCM. However, this reduces the contact area between the PCM and the chamber wall, thereby negatively impacting the thermal conductivity of the heat sink. Moreover, this method is unsuitable for multi-directional mounting usage.
To overcome the aforementioned challenges, the Singapore research institute has developed a passive thermal management system that can accommodate the expansion of the PCM without any negative impact to thermal conductivity. This is achieved by using a mechanism that can relieve the pressure within the chamber during the expansion of PCM.
A comparative study was conducted to establish the efficacy of the developed system. A typical PCM-based heat sink that has a 20% volumetric void space was used for the purpose of the research. An infrared thermal imager; fluke Ti400, was used to capture the surface temperature of the PCM- based heat sink assembly over a constant heated surface of 50 degrees Celsius.
It was established that the fastening system employed by the PCM-based heat sink with volumetric expansion control has the ability to allow uninterrupted contact between all faces of the heat sink, thereby ensuring a larger surface area for heat transfer to occur.
The developed system also removes the need for accommodating a void space for thermal expansion and maintains a constant contact interface between the PCM and heat sink walls.
The developed PCM-based heat sink can be used as a viable alternative to the conventional heat sinks used in electronic and electrical devices, such as battery cells and converters that generate large amounts of heat during their operation, to aid in the removal & regulation of heat.
The institute is keen to establish partnerships with industry players (SMEs of all sizes/MNEs such as electronics & electrical device manufacturers, OEMs and component manufacturers).
The type of partnership sought can be a licensing agreement,
where partner can license the technology to offer as a product or service to their customers.
The developed system overcomes the issues with air voids that are common in conventional heat sinks and also allows for a constant contact surface area between the PCM and heat sink walls, thereby ensuring effective thermal management. The developed heat sink finds application as a cooling system in underwater systems, deep-sea power systems, electrical vehicles and electric converters.
Patent is grant for Singapore. Technology is available for licensing.
The Singapore institution seeks to work with SMEs/MNEs of all sizes in a licensing agreement partnership.
The partner sought could be an electrical or electronic component manufacturer or an OEM or a device manufacturer.
Under a licensing agreement:
- The partner can license the technology to offer as a product or service to their customers.