This event has ended.
EU-Japan Semicon Matching
The onsite matching event held during Semicon Japan trade fair targets EU SMEs and Japanese companies active in the semiconductor industry.
When: 11-13 December 2024
Where: Tokyo, Japan
Application deadline: 10 December 2024
https://www.b2match.com/e/eu-japan-digital/components/45220
The onsite matching event held during Semicon Japan trade fair targets EU SMEs and Japanese companies active in the semiconductor industry.
When: 11-13 December 2024
Where: Tokyo, Japan
Application deadline: 10 December 2024
https://www.b2match.com/e/eu-japan-digital/components/45220
- Brokerage event
- -
- Tokyo, Japan
Practical information
- Where
- 3 Chome-11-1 Ariake, Koto City
- When
- -
- Host organisation
- EU-Japan Centre for Industrial Cooperation
- Website
- https://www.b2match.com/e/eu-japan-digital/components/45220
Description
Around 50 progressive EU companies in the semiconductor industry will come to Japan as part of the EU Business Hub and exhibit at Semicon Japan from 11 December - 13 December 2024 at Tokyo Big Sight. The EU companies are highly interested in cooperating and collaborating with Japanese companies.
This Platform brings together those (and more) companies from Europe and Japan through meetings to create new business partnerships that will lead to innovative semiconductor-related technologies, processes and applications.
The Platform based on the idea of open innovation. Registrants create profiles including their "Offers" and "Requests" or "Seeds and "Needs", which will allow them to identify potential partners. Registered participants can browse each other's profiles and search for potential partners by keywords and categories. It is possible to send messages or request meetings, which will be pre-set and take place onsite in Japan.
Target audience
European SMEs and start-ups and Japanese enterprises involved in the semiconductor sector:
• Advanced semiconductors and future applications: e.g. AI, machine learning, 5G/6G communication technology, etc.
• Semiconductor manufacturing equipment: e.g. semiconductor design equipment, mask manufacturing equipment, wafer manufacturing equipment, etc.
• Components and materials for semiconductor manufacturing: e.g. process materials, test materials, assembly materials, etc.
• Services and software
When: 11-13 December 2024
Where: Tokyo, Japan
Application deadline: 10 December 2024
https://www.b2match.com/e/eu-japan-digital/components/45220
This Platform brings together those (and more) companies from Europe and Japan through meetings to create new business partnerships that will lead to innovative semiconductor-related technologies, processes and applications.
The Platform based on the idea of open innovation. Registrants create profiles including their "Offers" and "Requests" or "Seeds and "Needs", which will allow them to identify potential partners. Registered participants can browse each other's profiles and search for potential partners by keywords and categories. It is possible to send messages or request meetings, which will be pre-set and take place onsite in Japan.
Target audience
European SMEs and start-ups and Japanese enterprises involved in the semiconductor sector:
• Advanced semiconductors and future applications: e.g. AI, machine learning, 5G/6G communication technology, etc.
• Semiconductor manufacturing equipment: e.g. semiconductor design equipment, mask manufacturing equipment, wafer manufacturing equipment, etc.
• Components and materials for semiconductor manufacturing: e.g. process materials, test materials, assembly materials, etc.
• Services and software
When: 11-13 December 2024
Where: Tokyo, Japan
Application deadline: 10 December 2024
https://www.b2match.com/e/eu-japan-digital/components/45220