Summary
- Profile Type
- Research & Development Request
- POD Reference
- RDRGB20250501002
- Term of Validity
- 6 May 2025 - 6 May 2026
- Company's Country
- United Kingdom
- Type of partnership
- Research and development cooperation agreement
- Targeted Countries
- Spain
- Netherlands
- Germany
- Austria
- Belgium
- Italy
- Portugal
- Romania
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General information
- Short Summary
- Welsh SME supplying design and medium volume manufacture of embedded die packaging solutions for semiconductor and electronics industries worldwide, has developed a patented, advanced packaging technology that enables the creation of high-density power converters through the embedding of semiconductor dies in 2D & 3D structures.
- Full Description
-
This SME was originally established as an expert contract R&D organisation for the semiconductor sector but over the last 5 years has transitioned into developing their own patents and processing technologies and are looking to utilise their technology and expertise within the power conversion equipment sector.
This patented advanced packaging technology enables the creation of high-density power converters through the embedding of semiconductor dies in 2D and 3D structures. As well as achieving significant improvements in energy efficiency, this process improves thermal management and because the dies are embedded within a PCB structure, the power modules are mechanically more robust than the incumbent technology and protected from the environment.
This is relevant for power conversion equipment in wind turbines, solar farms in hot climates, power conversion equipment used in energy and mineral extraction activities, aerospace, underwater and even for satellite applications.
They are looking to partner with a designer/manufacturer of power conversion equipment (Inverters, DCDC Converters, Battery Chargers) used in these hash environments. The aim would be to via Vinnovate R&D funding, design the embedded die packaging system to the partner’s requirement and jointly test the results with a view to future commercial agreements.
Vinnovate eligible regions are thought to include the following :-
Basque Country, East NL (Gelderland and Overijssel provinces), Emilia Romagna, Flanders, Galicia, Lombardy, Lower Austria, Lower Saxony, Norte, Northeast Romania, Noord Brabant, Wales. - Advantages and Innovations
- As well as achieving significant improvements in energy efficiency, this patented embedded die packaging process improves thermal management and because the dies are embedded within a PCB structure, the power modules are mechanically more robust than the incumbent technology and protected from potentially harsh environment.
- Technical Specification or Expertise Sought
-
Expertise required is in the domain of power conversion equipment (inverters, DCDC converters, battery chargers etc.) The partner should be an established organisation with a history of designing and manufacturing power conversion equipment for high reliability applications.
Partner should be interested in high switching frequencies, wide bandgap devices, overcoming thermal challenges, reducing size and weight, multi-phase inverters, isolated/non-isolated DC-DC.
The partner should have the capability to test power modules over a broad range of voltages and currents. - Stage of Development
- Lab tested
- Sustainable Development Goals
- Goal 12: Responsible Consumption and Production
- Goal 9: Industry, Innovation and Infrastructure
- IPR status
- IPR applied but not yet granted
Partner Sought
- Expected Role of a Partner
- Collaborative development of embedded die packaging system for power conversion equipment designed to partner specification. The partner should have the capability to test power modules over a broad range of voltages and currents.
- Type and Size of Partner
- SME 11-49
- R&D Institution
- Big company
- SME 50 - 249
- SME <=10
- Type of partnership
- Research and development cooperation agreement
Call details
- Framework program
- Research for the benefit of SMEs
- Call title and identifier
-
VInnovate 2025 -Energy-related Applications in Harsh Environments
- Submission and evaluation scheme
-
Further information available on https://www.s3vanguardinitiative.eu/multipurpose-page/call-2025
- Anticipated project budget
-
Min 100,00 Euros project total
- Coordinator required
-
Yes
- Deadline for EoI
- Deadline of the call
- Web link to the call
- https://www.s3vanguardinitiative.eu/multipurpose-page/call-2025
- Research for the benefit of SMEs
Dissemination
- Technology keywords
- 001001005 - Embedded Systems and Real Time Systems
- 001001015 - Semiconductors
- Market keywords
- 03003 - Power Supplies
- 03001002 - Customised semiconductors
- Sector Groups Involved
- Electronics
- Targeted countries
- Spain
- Netherlands
- Germany
- Austria
- Belgium
- Italy
- Portugal
- Romania